Digantara is a leading Space Surveillance and Intelligence company focused on ensuring orbital safety and sustainability. With expertise in space-based detection, tracking, identification, and monitoring, Digantara provides comprehensive domain awareness across regimes, allowing end users to have actionable intelligence on a single platform. At the core of its infrastructure lies a sophisticated integration of hardware and software capabilities aligned with the key principles of situational awareness: perception (data collection), comprehension (data processing), and prediction (analytics). This holistic approach empowers Digantara to monitor all Resident Space Objects (RSOs) in orbit, fostering comprehensive domain awareness.

Digantara seeks a highly skilled Senior PCB Design Engineer to design and develop cutting-edge PCB schematics and layouts tailored specifically for FPGA-based high-speed digital systems. You will leverage your expertise to enable state-of-the-art embedded hardware development with applications such as tracking objects from both space and the ground.

Why Us?

Be part of a collaborative and innovative environment where your ideas and skills make a real difference to the entire space realm.
Push the boundaries with hands-on experience, greater responsibilities, and rapid career advancement.
Competitive incentives, galvanising workspace, blazing team, frequent outings—pretty much everything that you have heard about a startup.

Responsibilities:

Designed and developed high-quality PCB schematics and layouts for FPGA-based systems and CMOS image sensor boards, ensuring compliance with industry standards.
Design and develop complex PCB schematics and layouts, optimizing signal and power integrity, using industry-standard CAD tools (e.g., Altium Designer, Cadence OrCAD).
Implement power and thermal management solutions and apply EMI/EMC mitigation techniques.
Implement PCB design guidelines for satellite electronics hardware across the entire PCB design lifecycle.
Collaborate with hardware, software, and system engineers to understand functional requirements, optimize PCB designs, and define and refine electrical circuit designs.
Collaborate with vendors to ensure high-quality PCB manufacturing and assembly for satellite applications.
Develop and execute test plans to validate the hardware performance of high-speed FPGA boards and CMOS image sensor boards.

Required Qualifications:

Bachelor's or Master's in Electronics/Electrical Engineering or a related field.
3+ years of experience in PCB schematic, layout design, and development, focusing on High-speed FPGA-based digital and mixed-signal designs.
Proven track record in building high-speed multi-layer PCBs employing FPGAs, DDR, LVDS, SERDES, Ethernet, USB, SRAM, Flash memories, etc.
Proficiency in schematic design and PCB layout using tools such as Altium Designer or Cadence Allegro.
Understanding of thermal management in embedded hardware.
Strong understanding of signal integrity and power integrity concepts and experience with advanced simulation tool-based analysis.
Generation and review of design outputs (Netlist, Gerber files, bill of materials) and ensure design for manufacturability and testability.
Experience working with vendors for PCB fabrication and assembly, BOM management, and hardware assembly.
Strong problem-solving skills with the ability to troubleshoot and debug FPGA-based hardware issues, especially in imaging systems.
Stay updated on emerging technologies and best practices in high-speed digital design, mixed-signal design, PCB layout, and relevant areas of expertise.

Preferred Skills:

Experience in PCB design for satellite applications, particularly satellite bus/payload electronics for imaging systems and PCB design for CMOS imaging sensors and electronics, is highly valued.
Experience in FPGA-based hardware bring-up and functional testing, including debugging, validation, and integration with ground or space-based imaging systems.
Working knowledge of Power circuits, Embedded systems, FPGA/SoC architecture, interface devices, and data communication protocols.
Familiarity with PCB design for imaging systems with CMOS imaging sensors/Photodetectors.
Select appropriate components and peripherals for the PCB design, considering factors such as performance, cost, and availability.
Knowledge of industry standards for PCB design (e.g., IPC-6012DS) and PCB manufacturing processes (e.g., SMT, through-hole).

General Requirements:

Ability to work in a mission-focused, operational environment.
Ability to think critically and make independent decisions.
Interpersonal skills to enable working in a diverse and dynamic team.
Maintain a regular and predictable work schedule.
Writing and delivering technical documents and briefings.
Verbal and written communication skills, as well as organizational skills.
Travel occasionally as necessary.

Work Location: Hebbal, Bangalore